Prediction of multiple-feature effects in plasma etching
نویسندگان
چکیده
Charging and topography evolution simulations during plasma etching of dense line-and-space patterns reveal that multiple-feature effects influence critically the etch profile characteristics of the various lines. By including neighboring lines, the simulation predicts a peculiar notching behavior, where the extent of notching varies with the location of the line. Feature-scale modeling can no longer be focused on individual features alone; ‘‘adjacency’’ effects are crucial for understanding and predicting the outcome of etching experiments at reduced device dimensions. © 1997 American Institute of Physics. @S0003-6951~97!00318-5#
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تاریخ انتشار 1997